Smart Packaging Automation with PackML & OPC UA – Conference
Date.: 15th and 16th March 2017
Place: Microsoft, Development Center Copenhagen, Kanalvej 7, 2800 Lyngby, Denmark
Presentation 15th March 2017:
| Keyspeaker | Presentation |
| SESAM/OMAC | Introduction to the conference |
| David Bojesen, Microsoft | Transforming your production in a digital world |
| Kasper Korsholm og Lasse Hedeby, Velux | Standardized TCP/IP interface based on PackML philosophy for PLC’s |
| Spencer Cramer, ei3 | Ways to optimize production by using PackML and the IIoT |
| Rainer Bayrhammer, HAAS | PackML and OPC UA technical implementation |
| John Asbjørn Skajem, Beumer Group | PackML as the basis for the new machines and lines |
| Carsten Nøkleby, SESAM | PackML training |
Presentation 16th March 2017:
| Keyspeaker | Presentation |
| Christian Hock, Siemens (OPC Foundation Rep.) | OPC UA for automation and PackML information model |
| Claus Norup, Arla Foods | The journey with PackML |
| Filippo Serafini, Tetra Pak | PackML from a machine and solution providers point of view |
| Heinz-Hermann Brümmer, meurer Verpackungssysteme | Understanding PackML |
| Lee Smith, Mettler Toledo | Will not be accessible |
| Per Jarlvik, Norden Machinery | PackML experiences |
Photos from Conference
