Smart Packaging Automation with PackML & OPC UA – Conference
Date.: 15th and 16th March 2017
Place: Microsoft, Development Center Copenhagen, Kanalvej 7, 2800 Lyngby, Denmark
Presentation 15th March 2017:
Keyspeaker | Presentation |
SESAM/OMAC | Introduction to the conference |
David Bojesen, Microsoft | Transforming your production in a digital world |
Kasper Korsholm og Lasse Hedeby, Velux | Standardized TCP/IP interface based on PackML philosophy for PLC’s |
Spencer Cramer, ei3 | Ways to optimize production by using PackML and the IIoT |
Rainer Bayrhammer, HAAS | PackML and OPC UA technical implementation |
John Asbjørn Skajem, Beumer Group | PackML as the basis for the new machines and lines |
Carsten Nøkleby, SESAM | PackML training |
Presentation 16th March 2017:
Keyspeaker | Presentation |
Christian Hock, Siemens (OPC Foundation Rep.) | OPC UA for automation and PackML information model |
Claus Norup, Arla Foods | The journey with PackML |
Filippo Serafini, Tetra Pak | PackML from a machine and solution providers point of view |
Heinz-Hermann Brümmer, meurer Verpackungssysteme | Understanding PackML |
Lee Smith, Mettler Toledo | Will not be accessible |
Per Jarlvik, Norden Machinery | PackML experiences |
Photos from Conference